Research Associate for Interconnect Technologies (all genders)

Developing innovative technology solutions and bringing them to application - that is our goal at the Fraunhofer Institute for Photonic Microsystems IPMS .

Our »Center Nanoelectronic Technologies« (CNT) conducts research on 300 mm wafers for microchip manufacturers, suppliers, device manufacturers, and R&D partners. We offer process and technology developments as well as services at the ULSI (ultra-large-scale integration) level in the areas of front-end (FEoL) and back-end-of-line (BEoL) for various CMOS technology nodes.

The associated Interconnect Technologies group, which is part of our Neuropmorphic Computing business unit, focuses on technologies for metallization in the BEOL (back end of line) of CMOS manufacturing and the border area to advanced packaging. The core theme of the group is the creation of copper lines through electrochemical deposition (ECD) and chemical mechanical polishing (CMP), as well as all wet chemical cleaning steps.

Be part of change

• Research and development in the field of interconnect technologies
• BEOL process integration of existing UPD solutions to set up a complete BEOL metallization module
• Evaluation and potential development of novel metallization solutions
• Evaluation and responsibility for complex project ideas with regard to feasibility and the associated measures in the 300mm cleanroom
• Development of synergies between classic BEOL technologies and advanced packaging, in particular silicon interposer technologies
• Scientific supervision of existing CMP processes and development of new solutions
• Project management and acquisition for industrially and publicly funded projects
• Scientific exchange and presentation of research results at conferences and participation in workshops

What you contribute

• Completed university degree (master's/diploma)in microelectronics, materials science, electrical engineering, physics, or a comparable field
• Three to five years of previous professional experience or a completed doctorate
• Know-how in the field of semiconductor manufacturing technologies , especially in BEOL or BE, preferably on HVM equipment platforms, e.g.:
  • Thin film deposition (PVD)
  • Chemical mechanical polishing (CMP)
  • Advanced packaging
  • BEOL process integration
• In-depth expertise in working with industrial partner companies
• Experience in project management ; ideally with responsibility for acquiring publicly funded projects and direct industrial contracts
• Great knowledge of common analysis and measurement methods
• Independent and proactive approach to work with a focus on reliability and precision
• Pragmatic, flexible approach to work – especially in the event of unforeseen project changes
• Enthusiastic and friendly personality with a strong interest in working in a research environment
• Strong communication skills with good German (B level) and very good English (C level)

What we offer

Our benefits:

• Attractive and international working environment in an innovative industry of the future
• Extensive and varied training and qualification opportunities
• Work-life balance thanks to flexible working hours and the option of mobile working
• Company pension scheme
• Job ticket for public transport
• 30 days vacation
• Corporate benefits

An overview of all benefits and other good reasons to join us can be found here.

We offer female scientists the opportunity to participate in our TALENTA program: a comprehensive career and development program that includes individually tailored qualification offers. You can find out more here.

The weekly working time is 39 hours. This position is also available on a part-time basis. The position is initially limited to 2 years. Long-term employment is sought. We value and promote the diversity of our employees' skills and therefore welcome all applications – regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability. Our tasks are diverse and adaptable – for applicants with disabilities, we work together to find solutions that best promote their abilities. Appointment, remuneration and social security benefits based on the public-sector collective wage agreement (TVöD). Additionally Fraunhofer may grant performance-based variable remuneration components.

With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.

Ready for a change? Then apply now and make a difference! Once we have received your online application, you will receive an automatic confirmation of receipt. We will then get back to you as soon as possible and let you know what happens next.

Contact

Ms. Isabell Zwinscher
Human Resources
Telephone: +49 (0)351 8823 1227

Mr. Dr. Conrad Guhl
Specialty Department
Telephone: +49 (0)351 2607 3235

Fraunhofer Institute for Photonic Microsystems IPMS

Requisition Number: 83339