Internship - R&D CMOS Integration in Dresden
About GF
GlobalFoundries® Inc. (GF®) is one of the world's leading semiconductor manufacturers. GF redefines innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions with leading performance in all growth markets. GF offers a unique mix of design, development and manufacturing services. With a talented and diverse team and manufacturing locations in the U.S., Europe and Asia, GF is a trusted technology provider to its global customers. GF employs approximately 13,000 people, including more than 3,000 in Dresden, Germany.
Introduction
GlobalFoundries is a leading full‑service semiconductor manufacturer with advanced fabrication sites across the globe. Our Dresden site (F1) develops and manufactures differentiated CMOS technologies, including 22FDX® – a key enabler for ultra‑low‑power electronics, embedded NVM, and emerging quantum applications. The Technology Architect Group (TAG) is responsible for long‑term technology pathfinding, device research, and cross‑node innovation including ferroelectric memory development, AI hardware enablement, and quantum computing concepts. We are offering a highly selective internship for students with strong technical curiosity and passion for semiconductor devices, ferroelectrics, and advanced CMOS research.
Your Job
As an intern in R&D CMOS Integration , you will work closely with the Technology Architect Group on early‑stage research and exploratory technology development. Your work may include:
Ferroelectric HfO₂ Memory (FeFET / FeCAP)
Supporting experimental development of HfO₂‑based ferroelectric memory devices
Assisting in material‑ and device‑level characterization (polarization loops, retention, endurance behavior)
Processing and analyzing electrical, thermal, and reliability datasets
Evaluating integration pathways into 22FDX® FDSOI CMOS flows
AI‑Accelerated Device & Process Development
Assisting in development of AI/ML approaches for device variability analysis, defect classification, or predictive modeling
Training lightweight neural models for semiconductor data (Python‑based workflows)
Research on AI‑assisted pattern recognition and automated data labeling
22FDX‑Based Quantum Computing Concepts
Supporting feasibility assessments of quantum‑relevant device structures in FDSOI
Reviewing literature on qubit architectures, cryogenic electronics, and ferroelectric quantum materials
Contributing to simulation or modelling tasks (e.g., MATLAB, Python, C‑based tools)
General R&D Support
Preparing technical documentation, experiment reports, and presentations
Participating in cross‑functional meetings with Device Engineering, TCAD, Materials Science and Integration teams
Required Qualification
This internship is ideal for students who are passionate about semiconductor physics, microelectronics, embedded systems, AI‑based engineering workflows, and real‑world device development.
Enrollment in Electrical Engineering, Electronics, Semiconductor Devices, Computer Engineering, or similar
Foundational knowledge in semiconductors, MOSFET physics, microelectronics, digital design and embedded systems
Strong analytical and problem‑solving skills
Ability to work independently, manage tasks, and thrive in a research‑focused environment
Excellent communication skills in English (C1)
Preferred Qualifications
Experience with programming languages such as Python, C, Arduino/ESP32 , or parallel programming environments
Familiarity with tools like MATLAB, YOLO, SCADA/PLC systems, mission‑planning software, AutoCAD, or Raspberry Pi
Demonstrated hands‑on experience through technical projects , e.g. intensive use and understanding of modern AI tools, demonstration of team-skill in technological project execution, Semiconductor device‑related course projects (e.g., MOSCAP/MOSFET, digital logic, FPGA basics
We offer
The opportunity to become part of an open and dynamic team
Flexible working hours based on trust
Access to professional development opportunities
Competitive compensation
On-site cafeteria, gym, and physical therapy
Additional attractive benefits, such as health promotion programs and various employee discounts
Please include a current proof of enrollment with your application.
Key Details
Duration: 3 months
Full‑time university internship (3 months)
Information about our benefits you can find here: hier
Please apply here on "MINTbund.de" using the "Apply" link/button at the top right.
Note: Please apply exclusively via our direct application link hosted by Empfehlungsbund and MINTbund.de: . We look forward to getting to know you!
About GF
GlobalFoundries® Inc. (GF®) is one of the world's leading semiconductor manufacturers. GF redefines innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions with leading performance in all growth markets. GF offers a unique mix of design, development and manufacturing services. With a talented and diverse team and manufacturing locations in the U.S., Europe and Asia, GF is a trusted technology provider to its global customers. GF employs approximately 13,000 people, including more than 3,000 in Dresden, Germany.
Introduction
GlobalFoundries is a leading full‑service semiconductor manufacturer with advanced fabrication sites across the globe. Our Dresden site (F1) develops and manufactures differentiated CMOS technologies, including 22FDX® – a key enabler for ultra‑low‑power electronics, embedded NVM, and emerging quantum applications. The Technology Architect Group (TAG) is responsible for long‑term technology pathfinding, device research, and cross‑node innovation including ferroelectric memory development, AI hardware enablement, and quantum computing concepts. We are offering a highly selective internship for students with strong technical curiosity and passion for semiconductor devices, ferroelectrics, and advanced CMOS research.
Your Job
As an intern in R&D CMOS Integration , you will work closely with the Technology Architect Group on early‑stage research and exploratory technology development. Your work may include:
Ferroelectric HfO₂ Memory (FeFET / FeCAP)
Supporting experimental development of HfO₂‑based ferroelectric memory devices
Assisting in material‑ and device‑level characterization (polarization loops, retention, endurance behavior)
Processing and analyzing electrical, thermal, and reliability datasets
Evaluating integration pathways into 22FDX® FDSOI CMOS flows
AI‑Accelerated Device & Process Development
Assisting in development of AI/ML approaches for device variability analysis, defect classification, or predictive modeling
Training lightweight neural models for semiconductor data (Python‑based workflows)
Research on AI‑assisted pattern recognition and automated data labeling
22FDX‑Based Quantum Computing Concepts
Supporting feasibility assessments of quantum‑relevant device structures in FDSOI
Reviewing literature on qubit architectures, cryogenic electronics, and ferroelectric quantum materials
Contributing to simulation or modelling tasks (e.g., MATLAB, Python, C‑based tools)
General R&D Support
Preparing technical documentation, experiment reports, and presentations
Participating in cross‑functional meetings with Device Engineering, TCAD, Materials Science and Integration teams
Required Qualification
This internship is ideal for students who are passionate about semiconductor physics, microelectronics, embedded systems, AI‑based engineering workflows, and real‑world device development.
Enrollment in Electrical Engineering, Electronics, Semiconductor Devices, Computer Engineering, or similar
Foundational knowledge in semiconductors, MOSFET physics, microelectronics, digital design and embedded systems
Strong analytical and problem‑solving skills
Ability to work independently, manage tasks, and thrive in a research‑focused environment
Excellent communication skills in English (C1)
Preferred Qualifications
Experience with programming languages such as Python, C, Arduino/ESP32 , or parallel programming environments
Familiarity with tools like MATLAB, YOLO, SCADA/PLC systems, mission‑planning software, AutoCAD, or Raspberry Pi
Demonstrated hands‑on experience through technical projects , e.g. intensive use and understanding of modern AI tools, demonstration of team-skill in technological project execution, Semiconductor device‑related course projects (e.g., MOSCAP/MOSFET, digital logic, FPGA basics
We offer
The opportunity to become part of an open and dynamic team
Flexible working hours based on trust
Access to professional development opportunities
Competitive compensation
On-site cafeteria, gym, and physical therapy
Additional attractive benefits, such as health promotion programs and various employee discounts
Please include a current proof of enrollment with your application.
Key Details
Duration: 3 months
Full‑time university internship (3 months)
Information about our benefits you can find here: hier
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